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| Double Sided Printed Circuit Board |
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| Prodcution Capacity - 15,000 sqm/month |
| Sector Catered - Automobile, Consumer Electronics, Computer Periferals, Lighting, Telecom, Defence, etc. |
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| Prodcution Capability |
| Types of Laminates |
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CEM3, FR 4 |
| Laminate Thickness |
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0.2mm to 3.2mm |
| Cu Foil Thickness |
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35 micron to 105 micron |
| Minimum Track Width |
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4 mil |
| Minimum Spacing between the Tracks and Pads |
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4 mil |
| Maximum PCB Size |
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630mm X 1800mm |
| Minimum Hole Size (CNC Drilling) |
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0.2mm |
| Surface Finishing |
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OSP, Immersion Tin , Lead free HAl ENIG |
| Specification. Standards |
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IPC-A-600, IPC-SM-840, IPC-RB-276, IPC-TM-650. MIL 55110P, MIL P13949G |
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