 |
We acquired 21000 SQM in “SUPA Industrial Estate” MIDC on Ahmednagar-Pune Highway- in 2006 In view of our plan of setting up a plant of Double sided
& Multilayer PCB.
Current Status: Started Initial Work on this plant. Expected
to commence production by Nov. 2008.
|
|
 |
|
|
|
- Single Sided Printed Circuit Board
- Double Sided - Non Plated Through Hole (NPTH) Printed Circuit Board
| Types of Laminates |
: |
FR-1, FR-2, CEM-1, CEM-3,FR-4, PTFE(TACONIC) |
| Laminate Thickness |
: |
0.8mm, 1.2mm, 1.6mm |
| Cu Foil Thickness |
: |
17.5 micron, 35 micron, 70 micron, 105 micron |
| Minimum Track Width |
: |
0.15mm (6mil) for 35 micron Cu
0.20mm (8mil) for 70 micron Cu
|
| Minimum Spacing between
the Tracks and Pads |
: |
0.15mm(6mil) |
| Maximum PCB Size |
: |
610mm X 610mm |
| Minimum Hole Size (Punching) |
: |
0.7mm |
| Minimum Hole Size (CNC Drilling) |
: |
0.4mm |
| Circuit Finishing |
: |
SMD Pads, Conductive carbon keys, and over lays |
| Surface Finishing |
: |
Solder Mask on Bare Copper (SMOBC) with solderable Lacquer, Solder Mask on Bare Copper (SMOBC) with hot air leveling, Organic surface protective (OSP)
Roller Tinning, Peel able mask, Immersion Tin |
| Hole/Outer Profile |
: |
100% Punching & Blanking,
CNC Drilling & Routing
|
| Specification. Standards |
: |
IPC-A-600, IPC-SM-840, IPC-RB-276,
IPC-TM-650.
MIL 55110P, MIL P13949G |
|
|
|
