Multi Layer

Multilayer PCBs

At Epitome, we manufacture multilayer PCBs through a dedicated manufacturing plant at Supa with a capacity of 30,000 sq m per month. Our capabilities include manufacturing up to eight layers of multilayer PCBs. If you’ve been looking for superior multilayer PCBs for your application, Epitome has got you covered. Our multilayer PCBs offer a range of benefits, including the following.

  • Compact Size: Presence of multiple layers contributes to the compact size
  • Higher Endurance: Higher thickness due to multiple layers and more durability.
  • Lightweight: Multilayer PCBs comprise a design eliminating multiple connectors required for single and double-layered PCB interconnections.
  • Better Quality: Meticulous design process and a stringent production and QC.
  • Use of high-density components integrating multiple layers.
Features of Our Multilayer PCBs

Take a look at the features of our multilayer PCBs

  • Types of Laminates Used

    FR4, High TG FR 4

  • Laminate Thickness

    0.4 mm to 3.2 mm

  • Base Cu Foil Thickness

    18/18, 35/35, 70/70, and 105/105 µm

  • Min. Track Width/Space

    4/4 Mil

  • Min. Drill Size

    0.2 mm

  • Surface Finish

    OSP, HAL (Lead Free/ Tin Lead) Immersion Tin, Electrolytic Gold Plating, ENIG

  • Maximum PCB Size

    610 X 457mm

  • Number of Layers

    Up to 8 layers

  • Other Capabilities

    Carbon Key, Peelable, Via Filling, Blind and Buried Vias

Production Infrastructure Used in Multilayer PCBs

As a credible and competent manufacturer of multilayer PCBs, we use state-of-the-art manufacturing facilities to deliver phenomenal product quality.

  • Prepeg cold storage
  • Layup station – class 100K clean room
  • Horizontal oxide line
  • X-ray driller
  • Bonding welder
  • Cedal proto press
  • Mass lam press